Aktino today announced the official launch of its AK3000 platform, which allows carriers to deploy a long-reach DS3 (45 Mb/s) circuit over copper. The Irvine, Calif.-based company also said it has been shipping the AK3000 to select customers since October 2004.

Among the more unique aspects of the platform is its use of Multiple Input Multiple Output (MIMO) techniques, which is one of the first times its been used in the wireline domain. By applying MIMO techniques, more typically used in wireless networks, Aktino believes it has solved the cross-talk problem that occurs when bonding copper pairs in the same binder.

"We are the only company that is treating the multi-pair bonding solution by using single pair silicon," said Hamid Lalani, senior vice president of marketing and product management for Aktino. "The problem in the multi-pair environment is that one plus one is never equal to two. We actually treat our pairs of copper as individual antenna in a binder group."

And while Lalani admits that the DSLAM market is crowded, Aktino is targeting markets larger vendors have overlooked.

"Our focus in the beginning is to focus on what we call cost-driven tactical infrastructure applications," he said. "One of the big applications for us is cell site back haul. We believe it's $200 million over the next four years, but if I'm at Alcatel, $200 million isn't going to interest me."