ArrayComm CEO Sam Endy has thrown his lot with a small wireless chipset manufacturer, announcing yesterday he had left the broadband wireless heavyweight to take the chief executive job with Telecis Wireless.

Telecis is a semiconductor company that develops system-on-a-chip technologies that span the IEEE 802.11 standards, but Telecis officials said Endy would help guide the company beyond the WLAN market and into the wide-area realm of WiMAX. Endy took over as CEO of ArrayComm in 2003 when founder Martin Cooper stepped down, and while ArrayComm made no public announcement of Endy’s departure (the company is privately held), Endy has been excised from the executive profiles on the Web site with no temporary replacement named.

Before he was CEO of ArrayComm, Endy served as the company’s chief operating officer where he guided the companies key iBurst broadband wireless platform and IntelliCell smart antenna technology from development to commercial launch. Telecis said before Endy left ArrayComm he was prepping the company’s antenna technology for an entry into the 802.16 antenna technologies, though the vendor has made no official announcement of a WiMax product.

What ArrayComm didn’t announce, though, Telecis is perfectly willing to hype: Endy will oversee the chip vendor’s expansion into both the 802.16d (WiMAX-2004) and 802.16e areas. Ultimately, Telecis said, the vendor plans to introduce a system-on-a-chip solution that will combine both WiMAX technologies as well as Wi-Fi onto a single ASIC.